Invention Grant
- Patent Title: Form, fill, and seal system
- Patent Title (中): 形式,填充和密封系统
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Application No.: US12781794Application Date: 2010-05-17
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Publication No.: US08234840B2Publication Date: 2012-08-07
- Inventor: Mark Griffin , Steven Davis , John Hildebrand , Todd Jahnke
- Applicant: Mark Griffin , Steven Davis , John Hildebrand , Todd Jahnke
- Applicant Address: US CA San Bernardino
- Assignee: Winpak Lane, Inc.
- Current Assignee: Winpak Lane, Inc.
- Current Assignee Address: US CA San Bernardino
- Main IPC: B65B61/20
- IPC: B65B61/20 ; B65B61/18 ; B65B9/20 ; B31B1/84

Abstract:
A form, fill and seal system having a product fill assembly, a tube forming assembly and a fitment securing assembly. The system allows for the relative positioning of the fitment that is to be applied to the film that forms the bags, at various points along the film by having the fitment securing assembly relatively positionable with respect to the tube forming assembly. In turn, with adjustments, a fitment can be located at a number of locations on a finished bag.
Public/Granted literature
- US20110047939A1 Form, Fill, and Seal System Public/Granted day:2011-03-03
Information query
IPC分类: