Invention Grant
- Patent Title: Substrate inductive devices and methods
- Patent Title (中): 基片电感器件及方法
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Application No.: US13185312Application Date: 2011-07-18
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Publication No.: US08234778B2Publication Date: 2012-08-07
- Inventor: Christopher P. Schaffer , Alan Lindner
- Applicant: Christopher P. Schaffer , Alan Lindner
- Applicant Address: US CA San Diego
- Assignee: Pulse Electronics, Inc.
- Current Assignee: Pulse Electronics, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Gazdzinski & Associates, PC
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F7/06

Abstract:
Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.
Public/Granted literature
- US20120011709A1 SUBSTRATE INDUCTIVE DEVICES AND METHODS Public/Granted day:2012-01-19
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