Invention Grant
- Patent Title: Processing method of slotted hole
- Patent Title (中): 开槽孔加工方法
-
Application No.: US12561244Application Date: 2009-09-16
-
Publication No.: US08234763B2Publication Date: 2012-08-07
- Inventor: Yosuke Murakami , Shingo Watanabe , Yukihiko Kawaguchi , Akihiro Morishita , Takahiro Akatsuka
- Applicant: Yosuke Murakami , Shingo Watanabe , Yukihiko Kawaguchi , Akihiro Morishita , Takahiro Akatsuka
- Applicant Address: JP Saitama
- Assignee: Showa Corporation
- Current Assignee: Showa Corporation
- Current Assignee Address: JP Saitama
- Agency: Babcock IP, PLLC
- Priority: JP2009-077068 20090326
- Main IPC: B24B39/00
- IPC: B24B39/00
Abstract:
In a processing method of a slotted hole for processing a hole in a processed subject and further processing a slot intersecting the hole, a process for generating a compressive residual stress c is applied to an inner diameter portion of the hole before the slot is processed.
Public/Granted literature
- US20100242244A1 PROCESSING METHOD OF SLOTTED HOLE Public/Granted day:2010-09-30
Information query
