A probe polishing method is provided for polishing probes by brining a polishing member into slide-contact with probes through a mounting table having thereon the polishing member transferred from a first receiving part. The probe polishing method includes transferring the polishing member from the first receiving part to the mounting table; detecting a presence of foreign materials on a top surface of the polishing member mounted on the mounting table; transferring the polishing member from the mounting table to a second receiving part when the foreign materials are detected on the top surface of the polishing member; removing the foreign materials from the polishing member in the second receiving part; and transferring the polishing member from which the foreign materials are removed from the second receiving part to the first receiving part.