A light-emitting diode element including a through hole and a thermal via hole is mounted. An electrical connection region and a heat radiation region with respect to a plurality of packages or substrates are separately mounted on a printed circuit board. Electrical connection is made in the printed circuit board, and a driver, a resistance, a capacitor, and the like are connected. Heat is diffused and radiated by heat transport to a heat radiation base material connected to the printed circuit board.