Invention Grant
US08194359B2 Piezoelectric element having etched portion to form stepped recesses between layers and manufacturing method thereof, head gimbal assembly, and disk drive device with the same 失效
具有蚀刻部分以在层之间形成台阶凹槽的压电元件及其制造方法,头万向架组件和具有相同的盘驱动装置

  • Patent Title: Piezoelectric element having etched portion to form stepped recesses between layers and manufacturing method thereof, head gimbal assembly, and disk drive device with the same
  • Patent Title (中): 具有蚀刻部分以在层之间形成台阶凹槽的压电元件及其制造方法,头万向架组件和具有相同的盘驱动装置
  • Application No.: US12153618
    Application Date: 2008-05-21
  • Publication No.: US08194359B2
    Publication Date: 2012-06-05
  • Inventor: MingGao YaoYu Sun
  • Applicant: MingGao YaoYu Sun
  • Applicant Address: CN Hong Kong
  • Assignee: SAE Magnetics (H.K.) Ltd.
  • Current Assignee: SAE Magnetics (H.K.) Ltd.
  • Current Assignee Address: CN Hong Kong
  • Agency: Nixon & Vanderhye PC
  • Main IPC: G11B5/56
  • IPC: G11B5/56 H01L41/22
Piezoelectric element having etched portion to form stepped recesses between layers and manufacturing method thereof, head gimbal assembly, and disk drive device with the same
Abstract:
A piezoelectric element comprises a first laminated structure body and a second laminated structure body. Side surfaces of the first and the second laminated structure bodies that are parallel to a laminating direction both have at least a portion etched to form a recess so that a step distance is formed between sides of the two adjacent electrode layers that are parallel to the laminating direction. The design of the step distance increases insulation resistance between the two adjacent electrode layers on the opposite surfaces of the piezoelectric layer, and lowers reject rate. The first and the second laminated structure bodies are symmetrically laminated and bonded together, thus optimizing force balancing performance. The present invention also discloses a method of manufacturing a PZT element, a HGA with the PZT element and a disk drive unit having such HGA.
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