Invention Grant
US08194356B2 Head-stack assembly including heat-dissipation and impedance-matching structure and hard-disk drive using the head-stack assembly
有权
头堆叠组件包括散热和阻抗匹配结构以及使用磁头组合组件的硬盘驱动器
- Patent Title: Head-stack assembly including heat-dissipation and impedance-matching structure and hard-disk drive using the head-stack assembly
- Patent Title (中): 头堆叠组件包括散热和阻抗匹配结构以及使用磁头组合组件的硬盘驱动器
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Application No.: US12644358Application Date: 2009-12-22
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Publication No.: US08194356B2Publication Date: 2012-06-05
- Inventor: Kazuhiro Nagaoka , Tatemi Ido , Nobumasa Nishiyama , Yuji Soga
- Applicant: Kazuhiro Nagaoka , Tatemi Ido , Nobumasa Nishiyama , Yuji Soga
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
- Current Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
- Current Assignee Address: NL Amsterdam
- Priority: JP2008-325688 20081222
- Main IPC: G11B5/55
- IPC: G11B5/55
Abstract:
A head-stack assembly. The head-stack assembly includes: a magnetic-recording head; a lead-suspension supporting the magnetic-recording head on an actuator arm; a metal plate coupled with the actuator arm; a resin layer disposed on the metal plate; a flexible-printed-circuit board disposed on the resin layer, and substantially perpendicularly connected to the lead-suspension; a arm-electronics module disposed on the flexible-printed-circuit board configured to shape a write-signal current waveform of a write signal to said magnetic-recording head; transmission lines disposed on the flexible-printed-circuit board configured to transmit the write signal to, and a read-back signal from, the lead-suspension; and, a single intermediate conductor layer that is disposed between the resin layer and the flexible-printed-circuit board, and having a planar shape substantially facing a bottom of the arm-electronics module and a bottom of the transmission lines.
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