A support assembly includes a base layer, a circuit defined along the base layer, and a first material molded on at least a portion of the base layer. The first material substantially forms a shape of at least a portion of the support assembly. Further disclosed is a molded suspension assembly. The molded suspension assembly includes a thin and elongate metallic substrate and a non-metallic material molded along at least a portion of one side of the metallic substrate. The non-metallic material interlocks with the metallic substrate. The molded suspension assembly includes a transducer support area at or near a first end of the molded suspension assembly.