Invention Grant
US08194323B2 Method for producing wafer lens assembly and method for producing wafer lens 有权
晶片透镜组件的制造方法及晶片透镜的制造方法

  • Patent Title: Method for producing wafer lens assembly and method for producing wafer lens
  • Patent Title (中): 晶片透镜组件的制造方法及晶片透镜的制造方法
  • Application No.: US12682460
    Application Date: 2009-04-08
  • Publication No.: US08194323B2
    Publication Date: 2012-06-05
  • Inventor: Naoko OkazakiShigeru HosoeMasashi Saito
  • Applicant: Naoko OkazakiShigeru HosoeMasashi Saito
  • Applicant Address: JP Tokyo
  • Assignee: Konica Minolta Opto, Inc.
  • Current Assignee: Konica Minolta Opto, Inc.
  • Current Assignee Address: JP Tokyo
  • Agency: Cozen O'Connor
  • Priority: JP2008-116639 20080428; JP2008-116645 20080428; JP2008-116654 20080428; JP2008-116663 20080428; JP2008-116669 20080428
  • International Application: PCT/JP2009/057185 WO 20090408
  • International Announcement: WO2009/133756 WO 20091105
  • Main IPC: G02B27/10
  • IPC: G02B27/10
Method for producing wafer lens assembly and method for producing wafer lens
Abstract:
There is provided a method for producing a wafer lens assembly capable of adhering a wafer lens and a spacer surely. The wafer lens assembly includes a first substrate including plural optical members formed of a curable resin on at least one surface, a second substrate joined to the first substrate, and a stop member arranged between the first and second substrates. The first and second substrates are adhered with an adhesive made of a photo-curable resin. The method includes an adhesive applying step of applying the adhesive made of a photo-curable resin on a joining area, a stop-member forming step, and a photo-curing step of irradiating and hardening the adhesive applied in the adhesive applying step with light after the stop-member forming step. The stop member is formed so as not to prevent the light irradiated in the photo-curing step from reaching the adhesive.
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