Invention Grant
US08194323B2 Method for producing wafer lens assembly and method for producing wafer lens
有权
晶片透镜组件的制造方法及晶片透镜的制造方法
- Patent Title: Method for producing wafer lens assembly and method for producing wafer lens
- Patent Title (中): 晶片透镜组件的制造方法及晶片透镜的制造方法
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Application No.: US12682460Application Date: 2009-04-08
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Publication No.: US08194323B2Publication Date: 2012-06-05
- Inventor: Naoko Okazaki , Shigeru Hosoe , Masashi Saito
- Applicant: Naoko Okazaki , Shigeru Hosoe , Masashi Saito
- Applicant Address: JP Tokyo
- Assignee: Konica Minolta Opto, Inc.
- Current Assignee: Konica Minolta Opto, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Cozen O'Connor
- Priority: JP2008-116639 20080428; JP2008-116645 20080428; JP2008-116654 20080428; JP2008-116663 20080428; JP2008-116669 20080428
- International Application: PCT/JP2009/057185 WO 20090408
- International Announcement: WO2009/133756 WO 20091105
- Main IPC: G02B27/10
- IPC: G02B27/10

Abstract:
There is provided a method for producing a wafer lens assembly capable of adhering a wafer lens and a spacer surely. The wafer lens assembly includes a first substrate including plural optical members formed of a curable resin on at least one surface, a second substrate joined to the first substrate, and a stop member arranged between the first and second substrates. The first and second substrates are adhered with an adhesive made of a photo-curable resin. The method includes an adhesive applying step of applying the adhesive made of a photo-curable resin on a joining area, a stop-member forming step, and a photo-curing step of irradiating and hardening the adhesive applied in the adhesive applying step with light after the stop-member forming step. The stop member is formed so as not to prevent the light irradiated in the photo-curing step from reaching the adhesive.
Public/Granted literature
- US20100208354A1 Method for Producing Wafer Lens Assembly and Method for Producing Wafer Lens Public/Granted day:2010-08-19
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