Invention Grant
- Patent Title: Systems or method for tracking die use or yield
- Patent Title (中): 跟踪模具使用或产量的系统或方法
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Application No.: US12439048Application Date: 2007-08-28
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Publication No.: US08193937B2Publication Date: 2012-06-05
- Inventor: Gary S. Levene
- Applicant: Gary S. Levene
- Applicant Address: unknown Kitchener, Ontario
- Assignee: Ontario Die International Inc.
- Current Assignee: Ontario Die International Inc.
- Current Assignee Address: unknown Kitchener, Ontario
- Agency: Bereskin & Parr LLP
- International Application: PCT/CA2007/001474 WO 20070828
- International Announcement: WO2008/025129 WO 20080306
- Main IPC: G08B13/14
- IPC: G08B13/14

Abstract:
According to one aspect, a system that includes an RFID (Radio Frequency Identification) tag reader, a plurality of cutting dies, a plurality of RFID tags connectable to the corresponding cutting dies, and a controller including a computer usable program code including program instructions for scanning instruction the RFID tag reader to scan the RFID tags, updating respective piece counts corresponding to specific shapes provided by some of the plurality of cutting dies, and displaying the respective piece counts.
Public/Granted literature
- US20090322534A1 SYSTEMS OR METHOD FOR TRACKING DIE USE OR YIELD Public/Granted day:2009-12-31
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