Invention Grant
- Patent Title: Electronic component and method of manufacturing same
- Patent Title (中): 电子元件及其制造方法
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Application No.: US12752875Application Date: 2010-04-01
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Publication No.: US08193894B2Publication Date: 2012-06-05
- Inventor: Hiromi Miyoshi , Masaki Inui , Hiromichi Tokuda
- Applicant: Hiromi Miyoshi , Masaki Inui , Hiromichi Tokuda
- Applicant Address: JP
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP
- Agency: Studebaker & Brackett PC
- Agent Tim L. Brackett, Jr.; John F. Guay
- Priority: JP2009-089646 20090402
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F7/06

Abstract:
An electronic component capable of obtaining a large inductance value and a high Q value and a method of manufacturing the electronic component are provided. A coil includes a plurality of coil conductors incorporated in a multilayer structure, a plurality of lands provided at the plurality of coil conductors, and a via-hole conductor connecting the plurality of lands. Lead-out conductors are incorporated in the multilayer structure and connect the coil and external electrodes. The plurality of coil conductors form a substantially rectangular loop path in plan view from the z-axis direction by overlapping each other. The plurality of lands protrude toward outside the path at a short side of the path and do not overlap the lead-out conductors in plan view from the z-axis direction.
Public/Granted literature
- US20100253464A1 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING SAME Public/Granted day:2010-10-07
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