Invention Grant
- Patent Title: Wire-wound coil
- Patent Title (中): 绕线线圈
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Application No.: US13165499Application Date: 2011-06-21
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Publication No.: US08193892B2Publication Date: 2012-06-05
- Inventor: Yoshiaki Ukawa , Toshikazu Inubushi
- Applicant: Yoshiaki Ukawa , Toshikazu Inubushi
- Applicant Address: JP
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP
- Agency: Studebaker & Brackett PC
- Agent Tim L. Brackett, Jr.; John F. Guay
- Priority: JP2008-329143 20081225
- Main IPC: H01F27/29
- IPC: H01F27/29

Abstract:
The disclosure provides a wire-wound coil that can prevent contact between an outer flange portion of the wire-wound coil and a mount board so as to prevent breakage of the outer flange portion and misalignment and unwinding of a wound conductive wire. A groove is provided in an outer side face of a flange at an end of a winding core, and an inner flange portion and an outer flange portion are provided on opposite sides of the groove. A distance from a bottom face of the groove to at least an outer side face of the outer flange portion that would be facing a mount board or is attached to a mount board is shorter than a distance from the bottom face of the groove to the inner flange portion.
Public/Granted literature
- US20110248810A1 WIRE-WOUND COIL Public/Granted day:2011-10-13
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