Invention Grant
US08193648B2 Method for detecting errors of exposed positions of a pre-layer and a current layer by an integrated alignment and overlay mark 有权
用于通过集成对准和重叠标记来检测预层和当前层的暴露位置的错误的方法

Method for detecting errors of exposed positions of a pre-layer and a current layer by an integrated alignment and overlay mark
Abstract:
An integrated alignment and overlay mark for detecting the exposed errors of the photolithography process between a pre-layer and a current layer is disclosed. The integrated alignment and overlay mark includes an alignment mark and an overlay mark in the same shot region. The alignment mark is formed surrounding the overlay mark; therefore, the gap or the orientation between the pre-layer and the current layer can be calculated in order to check the alignment accuracy of photolithography process.
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