Invention Grant
US08193645B2 Wafer-level, polymer-based encapsulation for microstructure devices
有权
用于微结构器件的晶片级聚合物基封装
- Patent Title: Wafer-level, polymer-based encapsulation for microstructure devices
- Patent Title (中): 用于微结构器件的晶片级聚合物基封装
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Application No.: US12858192Application Date: 2010-08-17
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Publication No.: US08193645B2Publication Date: 2012-06-05
- Inventor: Kensall D. Wise , Mayurachat Ning Gulari , Ying Yao
- Applicant: Kensall D. Wise , Mayurachat Ning Gulari , Ying Yao
- Applicant Address: US MI Ann Arbor
- Assignee: The Regents of the University of Michigan
- Current Assignee: The Regents of the University of Michigan
- Current Assignee Address: US MI Ann Arbor
- Agency: Marshall, Gerstein & Borun LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A device includes a first device structure having a semiconductor platform, and a second device structure having a microstructure spaced from the semiconductor platform. The device further includes a cable having a plurality of beams to couple the microstructure to the first device structure. Each beam of the plurality of beams has a polymer coating and a serpentine-shaped region.
Public/Granted literature
- US20100308456A1 Wafer-Level, Polymer-Based Encapsulation for Microstructure Devices Public/Granted day:2010-12-09
Information query
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