Invention Grant
- Patent Title: Heat conductive sheet and method for producing same, and powder module
- Patent Title (中): 导热片及其制造方法和粉末组件
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Application No.: US12675549Application Date: 2008-09-12
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Publication No.: US08193633B2Publication Date: 2012-06-05
- Inventor: Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
- Applicant: Kenji Mimura , Hideki Takigawa , Hiroki Shiota , Kazuhiro Tada , Takashi Nishimura , Hiromi Ito , Seiki Hiramatsu , Atsuko Fujino , Kei Yamamoto , Motoki Masaki
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-248927 20070926; JP2007-248936 20070926
- International Application: PCT/JP2008/066551 WO 20080912
- International Announcement: WO2009/041300 WO 20090402
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/10
Abstract:
Provided is a heat conductive sheet obtained by dispersing an inorganic filler in a thermosetting resin, in which the inorganic filler contains secondary aggregation particles formed by isotropically aggregating scaly boron nitride primary particles having an average length of 15 μm or less, and the inorganic filler contains more than 20 vol % of the secondary aggregation particles each having a particle diameter of 50 μm or more. The heat conductive sheet is advantageous in terms of productivity and cost and excellent in heat conductivity and electrical insulating properties.
Public/Granted literature
- US20100226095A1 HEAT CONDUCTIVE SHEET AND POWER MODULE Public/Granted day:2010-09-09
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