Invention Grant
US08193626B2 Semiconductor package including multiple chips and separate groups of leads
有权
半导体封装包括多个芯片和独立的引线组
- Patent Title: Semiconductor package including multiple chips and separate groups of leads
- Patent Title (中): 半导体封装包括多个芯片和独立的引线组
-
Application No.: US12630363Application Date: 2009-12-03
-
Publication No.: US08193626B2Publication Date: 2012-06-05
- Inventor: Chul Park , Hysong-seob Kim , Kun-dae Yeom , Gwang-man Lim
- Applicant: Chul Park , Hysong-seob Kim , Kun-dae Yeom , Gwang-man Lim
- Applicant Address: KR Maetan-dong, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Maetan-dong, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: KR10-2009-0022747 20090317
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package.
Public/Granted literature
- US20100117217A1 SEMICONDUCTOR PACKAGE Public/Granted day:2010-05-13
Information query
IPC分类:
