Invention Grant
- Patent Title: Semiconductor chip with reinforcing through-silicon-vias
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Application No.: US12889615Application Date: 2010-09-24
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Publication No.: US08193039B2Publication Date: 2012-06-05
- Inventor: Michael Z. Su , Gamal Refai-Ahmed , Bryan Black
- Applicant: Michael Z. Su , Gamal Refai-Ahmed , Bryan Black
- Applicant Address: US CA Sunnyvale CA Markham
- Assignee: Advanced Micro Devices, Inc.,ATI Technologies ULC
- Current Assignee: Advanced Micro Devices, Inc.,ATI Technologies ULC
- Current Assignee Address: US CA Sunnyvale CA Markham
- Agent Timothy M. Honeycutt
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of manufacturing includes connecting a first end of a first through-silicon-via to a first die seal proximate a first side of a first semiconductor chip. A second end of the first thu-silicon-via is connected to a second die seal proximate a second side of the first semiconductor chip opposite the first side.
Public/Granted literature
- US20120074579A1 SEMICONDUCTOR CHIP WITH REINFORCING THROUGH-SILICON-VIAS Public/Granted day:2012-03-29
Information query
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