A method of patterning a substrate that includes locating a single mask film over the substrate and forming first opening portions in first locations in the mask film. First electrical materials are deposited over the substrate and mask film to form patterned areas in the first locations. Second opening portions are formed in second locations different from the first locations in the mask film. Subsequently, second electrical materials are deposited over the substrate and mask film to form patterned areas in the first and second locations.