Invention Grant
US08193009B2 Apparatus and methods for packaging electronic devices for optical testing 失效
用于包装电子设备进行光学测试的装置和方法

Apparatus and methods for packaging electronic devices for optical testing
Abstract:
Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
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