Invention Grant
- Patent Title: Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board
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Application No.: US12837998Application Date: 2010-07-16
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Publication No.: US08192916B2Publication Date: 2012-06-05
- Inventor: Masahiro Miyasaka , Takashi Kumaki
- Applicant: Masahiro Miyasaka , Takashi Kumaki
- Applicant Address: JP Tokyo
- Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee: Hitachi Chemical Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JPP2005-150133 20050523; JPP2006-105416 20060406
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/004

Abstract:
A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below, wherein, at least one R represents a C1-10 alkoxy group or a C1-12 alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
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