Invention Grant
- Patent Title: Processed ECM materials with enhanced component profiles
- Patent Title (中): 加工的ECM材料具有增强的组件配置文件
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Application No.: US12178321Application Date: 2008-07-23
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Publication No.: US08192763B2Publication Date: 2012-06-05
- Inventor: Chad E. Johnson
- Applicant: Chad E. Johnson
- Applicant Address: US IN West Lafayette
- Assignee: Cook Biotech Incorporated
- Current Assignee: Cook Biotech Incorporated
- Current Assignee Address: US IN West Lafayette
- Agency: Woodard, Emhardt, Moriarty, McNett & Henry LLP
- Main IPC: A61K35/12
- IPC: A61K35/12 ; A61K35/38 ; A61K38/39
Abstract:
Described are medical graft materials and devices having improved properties relating to their component profiles.
Public/Granted literature
- US20080286268A1 PROCESSED ECM MATERIALS WITH ENHANCED COMPONENT PROFILES Public/Granted day:2008-11-20
Information query
