Invention Grant
- Patent Title: Method for manufacturing multiple layers of waveguides
- Patent Title (中): 制造多层波导的方法
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Application No.: US12517692Application Date: 2008-08-29
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Publication No.: US08192638B2Publication Date: 2012-06-05
- Inventor: Andrew T. S. Pomerene , Timothy J. Conway , Craig M. Hill , Mark Jaso
- Applicant: Andrew T. S. Pomerene , Timothy J. Conway , Craig M. Hill , Mark Jaso
- Applicant Address: US NH Nashua
- Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee Address: US NH Nashua
- Agency: Yudell Isidore Ng Russell
- Agent Antony Ng; Daniel J. Long
- International Application: PCT/US2008/074792 WO 20080829
- International Announcement: WO2009/051903 WO 20090423
- Main IPC: B29D11/00
- IPC: B29D11/00 ; G02B6/10 ; G02F1/00

Abstract:
A method for manufacturing multiple layers of waveguides is disclosed. Initially, a first cladding layer is deposited on a substrate, a first inner cladding layer is then deposited on the first cladding layer, and a first waveguide material is deposited on the first inner cladding layer. The first inner cladding layer and the first waveguide material are then selectively etched to form a first waveguide layer. Next, a second inner cladding layer followed by a second cladding layer are deposited on the first waveguide layer. The second inner cladding layer and the second cladding layer are removed by using a chemical-mechanical polishing process selective to the first waveguide material. A third inner cladding layer followed by a second waveguide material are deposited on the first waveguide material. The third inner cladding layer and the second waveguide material are then selectively etched to form a second waveguide layer. Finally, a fourth inner cladding layer followed by a third cladding layer are deposited on the second waveguide layer.
Public/Granted literature
- US20100025364A1 Method for Manufacturing Multiple Layers of Waveguides Public/Granted day:2010-02-04
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