Invention Grant
- Patent Title: Surface mount clip for routing and grounding cables
- Patent Title (中): 表面安装夹，用于布线和接地电缆
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Application No.: US12351663Application Date: 2009-01-09
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Publication No.: US08192209B1Publication Date: 2012-06-05
- Inventor: Chris T. Li , Steven Chase
- Applicant: Chris T. Li , Steven Chase
- Applicant Address: US NV Reno
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US NV Reno
- Agency: Lee & Hayes, PLLC
- Main IPC: H01R13/648
- IPC: H01R13/648
Abstract:
Disclosed is a clip is for routing and grounding a coaxial cable on a printed circuit board. The clip may be mechanically and electrically engaged to the printed circuit board and may be comprised of a resilient and conductive material. The clip engages and retains the coaxial cable and establishes an electrical connection between the coaxial cable and the printed circuit board. A sheath may be placed around a portion of the coaxial cable to engage the clip.
Information query
