Invention Grant
- Patent Title: Bend and peel tablet package
- Patent Title (中): 弯曲和剥皮片包
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Application No.: US11330728Application Date: 2006-01-12
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Publication No.: US08191711B2Publication Date: 2012-06-05
- Inventor: Michelle Nivala
- Applicant: Michelle Nivala
- Applicant Address: US MN Brooklyn Park
- Assignee: Cima Labs Inc.
- Current Assignee: Cima Labs Inc.
- Current Assignee Address: US MN Brooklyn Park
- Agency: Cima Labs Inc.
- Main IPC: B65D85/42
- IPC: B65D85/42

Abstract:
A blister package and method of removing a dosage form from a blister package are disclosed. In one embodiment, the blister package includes a unitary blister sheet and a unitary sheet of lidding material. The lidding sheet is peelably sealed to the blister sheet, and includes unsealed areas for facilitating the peeling of the lidding material from the blister sheet. The unsealed areas are preferably only accessible upon a bending of the blister package.
Public/Granted literature
- US20060283759A1 Bend and peel tablet package Public/Granted day:2006-12-21
Information query
IPC分类: