Invention Grant
- Patent Title: Head stack assembly incorporating device, magnetic disk device manufacturing device, and method of manufacturing magnetic disk device
- Patent Title (中): 磁头堆叠组合装置,磁盘装置制造装置以及制造磁盘装置的方法
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Application No.: US12727041Application Date: 2010-03-18
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Publication No.: US08191233B2Publication Date: 2012-06-05
- Inventor: Ryousuke Naide , Takeshi Kurumizawa
- Applicant: Ryousuke Naide , Takeshi Kurumizawa
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2009-068386 20090319
- Main IPC: G11B5/127
- IPC: G11B5/127 ; H04R31/00

Abstract:
According to one embodiment, a head stack assembly incorporating device connects a head stack assembly to the base of a magnetic disk device by screwing a connector on the bottom surface of the rotational shaft of the head stack assembly and a connector on the base of the magnetic device together. The head stack assembly incorporating device includes a chuck and a driving-force transmitter. The chuck pinches the rotational shaft of the head stack assembly from the upper surface of the head stack assembly to be fixed to the rotational shaft. The chuck is rotatable around the central axis of the rotational shaft. The driving-force transmitter transmits a rotational force to the chuck.
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