Invention Grant
US08174876B2 Fusion memory device embodied with phase change memory devices having different resistance distributions and data processing system using the same 有权
具有不同电阻分布的相变存储器件和使用其的数据处理系统的融合存储器件

  • Patent Title: Fusion memory device embodied with phase change memory devices having different resistance distributions and data processing system using the same
  • Patent Title (中): 具有不同电阻分布的相变存储器件和使用其的数据处理系统的融合存储器件
  • Application No.: US12647604
    Application Date: 2009-12-28
  • Publication No.: US08174876B2
    Publication Date: 2012-05-08
  • Inventor: Se Ho Lee
  • Applicant: Se Ho Lee
  • Applicant Address: KR Gyeonggi-do
  • Assignee: Hynix Semiconductor Inc.
  • Current Assignee: Hynix Semiconductor Inc.
  • Current Assignee Address: KR Gyeonggi-do
  • Agency: Ladas & Parry LLP
  • Priority: KR10-2009-0054891 20090619; KR10-2009-0071244 20090803
  • Main IPC: G11C11/00
  • IPC: G11C11/00
Fusion memory device embodied with phase change memory devices having different resistance distributions and data processing system using the same
Abstract:
A fusion memory device having phase change memory devices that have different resistance distributions and a corresponding data processing system is presented. The fusion memory device includes a first and a second phase change memory group arranged on the same chip. Because the second phase change memory group exhibits a resistance distribution different from that of the first phase change memory group, then the fusion memory device can be configured to simultaneously function as both a DRAM device and as a flash memory device. Because the first and second phase change memory groups can be composed of similar PRAM components, the corresponding manufacturing and driving circuitry is markedly simplified as compared to other fusion memory devices that have dissimilar DRAM and flash memory components.
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