Invention Grant
US08174830B2 System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling
有权
具有用于热扩散和冷却的内部泵送液态金属的衬底的系统和方法
- Patent Title: System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling
- Patent Title (中): 具有用于热扩散和冷却的内部泵送液态金属的衬底的系统和方法
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Application No.: US12116126Application Date: 2008-05-06
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Publication No.: US08174830B2Publication Date: 2012-05-08
- Inventor: Nathan P. Lower , Ross K. Wilcoxon , Qizhou Yao , David W. Dlouhy , John A. Chihak
- Applicant: Nathan P. Lower , Ross K. Wilcoxon , Qizhou Yao , David W. Dlouhy , John A. Chihak
- Applicant Address: US IA Cedar Rapis
- Assignee: Rockwell Collins, Inc.
- Current Assignee: Rockwell Collins, Inc.
- Current Assignee Address: US IA Cedar Rapis
- Agent Donna P. Suchy; Daniel M. Barbieri
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34
Abstract:
A circuit board includes a pump and a channel. The channel includes a liquid metal and a coating. The liquid metal is pumped through the channel by the pump and the coating reduces diffusion and chemical reaction between the liquid metal and at least portions of the channel. The liquid metal can carry thermal energy to act as a heat transfer mechanism between two or more locations on the substrate. The substrate may include electrical interconnects to allow electrical components to be populated onto the substrate to form an electronics assembly.
Public/Granted literature
- US20090279257A1 SYSTEM AND METHOD FOR A SUBSTRATE WITH INTERNAL PUMPED LIQUID METAL FOR THERMAL SPREADING AND COOLING Public/Granted day:2009-11-12
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