Invention Grant
- Patent Title: Thermal overload relay
- Patent Title (中): 热过载继电器
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Application No.: US12659283Application Date: 2010-03-03
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Publication No.: US08174350B2Publication Date: 2012-05-08
- Inventor: Yukinari Furuhata , Fumihiro Morishita , Takeo Kamosaki
- Applicant: Yukinari Furuhata , Fumihiro Morishita , Takeo Kamosaki
- Applicant Address: JP Tokyo
- Assignee: Fuji Electric FA Components & Systems Co., Ltd.
- Current Assignee: Fuji Electric FA Components & Systems Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agent Manabu Kanesaka
- Priority: JP2009-079395 20090327; JP2009-130687 20090529
- Main IPC: H01H71/16
- IPC: H01H71/16 ; H01H61/04 ; H01H75/08

Abstract:
A thermal overload relay has a case, a main bimetal bending upon detection of an overload current, a release lever rotatably supported by an adjusting link and rotating according to a shifter displaced in response to the bending of the main bimetals, and a contact reversing mechanism for change-over contacts responsive to a rotation of the release lever. The main bimetal, release lever and contact reversing mechanism are disposed in the case. The contact reversing mechanism has a movable plate, and a reversing spring stretched between the other side of the movable plate and a spring support. The other end of the movable plate and the spring support is positioned opposite a support point. The release lever has a release lever supporting part, a reversing spring pushing part, a cam contact part, and a displacement input part, in which the release lever supporting part is pivoted on the adjusting link.
Public/Granted literature
- US20100245019A1 Thermal overload relay Public/Granted day:2010-09-30
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