Invention Grant
- Patent Title: Fuse structure
- Patent Title (中): 保险丝结构
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Application No.: US12503641Application Date: 2009-07-15
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Publication No.: US08174091B2Publication Date: 2012-05-08
- Inventor: Kong-Beng Thei , Chung Long Cheng , Chung-Shi Liu , Harry Chuang , Shien-Yang Wu , Shi-Bai Chen
- Applicant: Kong-Beng Thei , Chung Long Cheng , Chung-Shi Liu , Harry Chuang , Shien-Yang Wu , Shi-Bai Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/00
- IPC: H01L29/00

Abstract:
An electrical fuse and a method of forming the same are presented. A first-layer conductive line is formed over a base material. A via is formed over the first-layer conductive line. The via preferably comprises a barrier layer and a conductive material. A second-layer conductive line is formed over the via. A first external pad is formed coupling to the first-layer conductive line. A second external pad is formed coupling to the second-layer conductive line. The via, the first conductive line and the second conductive line are adapted to be an electrical fuse. The electrical fuse can be burned out by applying a current. The vertical structure of the preferred embodiment is suitable to be formed in any layer.
Public/Granted literature
- US20090273055A1 Fuse Structure Public/Granted day:2009-11-05
Information query
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