Invention Grant
- Patent Title: On-chip interconnect fabric
- Patent Title (中): 片上互连面料
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Application No.: US13017824Application Date: 2011-01-31
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Publication No.: US08171186B1Publication Date: 2012-05-01
- Inventor: Brian Jason Karguth , Denis Roland Beaudoin , Akila Subramaniam
- Applicant: Brian Jason Karguth , Denis Roland Beaudoin , Akila Subramaniam
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Robert D. Marshall, Jr.; Wade James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: G06F13/36
- IPC: G06F13/36 ; G06F13/00

Abstract:
A method for performing write transactions in an interconnect fabric is described. A burst write transaction is received by a bridge coupled to a master. The burst transaction is initiated by a command phase that includes a wait state attribute. The bridge is also coupled to a second bus that is coupled to a slave destination device or to another bridge. The bridge may initiate a cut-through transaction to the second bus when the wait state attribute indicates a master inserted wait state will not be incurred during the burst transaction.
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