Invention Grant
- Patent Title: Measurement and endpointing of sample thickness
- Patent Title (中): 样品厚度的测量和终点
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Application No.: US12611023Application Date: 2009-11-02
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Publication No.: US08170832B2Publication Date: 2012-05-01
- Inventor: Richard J. Young , Brennan Peterson , Rudolf Johannes Peter Gerardus Schampers , Michael Moriarty
- Applicant: Richard J. Young , Brennan Peterson , Rudolf Johannes Peter Gerardus Schampers , Michael Moriarty
- Applicant Address: US OR Hillsboro
- Assignee: FEI Company
- Current Assignee: FEI Company
- Current Assignee Address: US OR Hillsboro
- Agency: Scheinberg & Griner, LLP
- Agent Michael O. Scheinberg; David Griner
- Main IPC: G01N23/04
- IPC: G01N23/04 ; G06F17/00

Abstract:
A method for Transmission Electron Microscopy (TEM) sample creation. The use of a Scanning Electron Microscope (SEM)—Scanning Transmission Electron Microscope (STEM) detector in the dual-beam focused ion beam (FIB)/SEM allows a sample to be thinned using the FIB, while the STEM signal is used to monitor sample thickness. A preferred embodiment of the present invention can measure the thickness of or create TEM samples by using a precise endpoint detection method. Preferred embodiments also enable automatic endpointing during TEM lamella creation and provide users with direct feedback on sample thickness during manual thinning. Preferred embodiments of the present invention thus provide methods for endpointing sample thinning and methods to partially or fully automate endpointing.
Public/Granted literature
- US20100116977A1 MEASUREMENT AND ENDPOINTING OF SAMPLE THICKNESS Public/Granted day:2010-05-13
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