Invention Grant
- Patent Title: Tester bundle
- Patent Title (中): 测试仪捆绑
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Application No.: US12054361Application Date: 2008-03-24
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Publication No.: US08170829B1Publication Date: 2012-05-01
- Inventor: D. Brice Achkir , Matt Heston , Marco Mazzini
- Applicant: D. Brice Achkir , Matt Heston , Marco Mazzini
- Applicant Address: US CA San Jose
- Assignee: Cisco Technology, Inc.
- Current Assignee: Cisco Technology, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: G01P21/00
- IPC: G01P21/00

Abstract:
An apparatus for testing multiple Small Form-Factor Pluggable Plus (SFP+) ports comprising: a first testing module; a second testing module; and a communications link coupled with the first and the second testing modules; wherein each of the testing modules includes: a SFP+ interface connectable to a port under test (PUT), a signal processing circuit including: a signal compensator configured to perform signal compensation on a signal received from the other testing module, and a signal modifier configured to: modify the compensated signal according to a set of predetermined modification parameters, and transmit the modified signal to the PUT.
Public/Granted literature
- US3115336A Furnace construction Public/Granted day:1963-12-24
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