A peripheral card EMI shielding scheme which comprises a sandwich of three layers. The first layer comprises a chassis rear wall (e.g., constructed of sheet metal). The next layer, which in certain embodiments is the middle of the sandwich, comprises a relatively thin plate (e.g., 0.15 mm+/−0.1 mm) with spring arms. The third layer comprises a sheet metal plate (in certain embodiments, the third layer has a similar thickness to the rear wall). The thick sheet metal plate completely covers the thin plate, except for areas where the spring arms protrude. The three plates are staked together by a method similar to an extrude-and-roll process (e.g., where one piece is fastened to another without the need for additional hardware or welding).