Invention Grant
- Patent Title: Electrostatic chuck
- Patent Title (中): 静电吸盘
-
Application No.: US12470169Application Date: 2009-05-21
-
Publication No.: US08169768B1Publication Date: 2012-05-01
- Inventor: Mohammed Tahmassebpur , Salam Harb
- Applicant: Mohammed Tahmassebpur , Salam Harb
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Luedeka Neely Group, P.C.
- Main IPC: H01T23/00
- IPC: H01T23/00

Abstract:
An electrostatic chuck for retaining a substrate. The chuck has a clamping surface for receiving the substrate, where the clamping surface is formed of a hard polymeric material filled with carbon nanotubes. Electrodes are disposed beneath the clamping surface, for inducing localized electrostatic charges in the substrate and thereby retaining the substrate against the clamping surface. A base supports the clamping surface and the electrodes.
Information query