Invention Grant
- Patent Title: Temperature compensation in integrated circuit
- Patent Title (中): 集成电路中的温度补偿
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Application No.: US12390085Application Date: 2009-02-20
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Publication No.: US08169764B2Publication Date: 2012-05-01
- Inventor: Toshinari Takayanagi , Conrad H. Ziesler , Zongjian Chen , Vincent R. von Kaenel
- Applicant: Toshinari Takayanagi , Conrad H. Ziesler , Zongjian Chen , Vincent R. von Kaenel
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
- Agent Lawrence J. Merkel
- Main IPC: H02H5/00
- IPC: H02H5/00

Abstract:
In an embodiment, an integrated circuit comprises a plurality of temperature sensors and a power manager coupled thereto. The temperature sensors are physically distributed over an area of the integrated circuit that is occupied by logic circuitry implementing the operations for which the integrated circuit is designed. The power manager is configured to transmit a power supply voltage request to an external power supply module, the power supply voltage request indicating a requested magnitude of the power supply voltage for the integrated circuit. The power manager is configured to modify the requested magnitude responsive to indications from each of the plurality of temperatures sensors that represent a temperature of the integrated circuit sensed by each of the plurality of temperature sensors.
Public/Granted literature
- US20100213919A1 TEMPERATURE COMPENSATION IN INTEGRATED CIRCUIT Public/Granted day:2010-08-26
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