Invention Grant
- Patent Title: Semiconductor device with integrated coils
- Patent Title (中): 集成线圈的半导体器件
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Application No.: US11753684Application Date: 2007-05-25
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Publication No.: US08169285B2Publication Date: 2012-05-01
- Inventor: Josef Höglauer , Bernhard Knott
- Applicant: Josef Höglauer , Bernhard Knott
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H04Q5/22 ; H01L29/66
Abstract:
A semiconductor device with a number of integrated coils is disclosed. In one embodiment, a first coil portion and a second coil portion are at least in part overlapping each other. Another embodiment provides a process for manufacturing a semiconductor device having at least the processes of generating a first coil portion, generating a second coil portion, wherein at least a part of the first coil portion and a part of the second coil portion are overlapping each other.
Public/Granted literature
- US20080290992A1 SEMICONDUCTOR DEVICE WITH INTEGRATED COILS Public/Granted day:2008-11-27
Information query
