A surface acoustic wave device in which miniaturization and a flat design implemented, is resistant to a deformation responsive to a pressure of a molten resin in the formation of a mold resin layer, and is less susceptible to a characteristic degradation. In the surface acoustic wave device, an IDT electrode is located on a piezoelectric substrate, and an insulator member is arranged such that a space B surrounding the IDT electrode is provided. For the purpose of reducing the area of the space B, reflectors having weighted portions are arranged on both sides of the IDT electrode. The weighted portions include electrode fingers of the reflectors that become shorter in length as they extend farther away from the IDT electrode. The shape of the space B is reduced accordingly.