Invention Grant
US08169276B2 Vertical transmission line structure that includes bump elements for flip-chip mounting
有权
垂直传输线结构，包括用于倒装芯片安装的凸块
- Patent Title: Vertical transmission line structure that includes bump elements for flip-chip mounting
- Patent Title (中): 垂直传输线结构，包括用于倒装芯片安装的凸块
-
Application No.: US13023235Application Date: 2011-02-08
-
Publication No.: US08169276B2Publication Date: 2012-05-01
- Inventor: Edward Yi Chang , Wei-Cheng Wu , Ruey-Bing Hwang , Li-Han Hsu
- Applicant: Edward Yi Chang , Wei-Cheng Wu , Ruey-Bing Hwang , Li-Han Hsu
- Applicant Address: TW Hsinchu
- Assignee: National Chiao Tung University
- Current Assignee: National Chiao Tung University
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Priority: TW97115188A 20080425
- Main IPC: H01P5/02
- IPC: H01P5/02
Abstract:
A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.
Public/Granted literature
- US20110121923A1 VERTICAL TRANSMISSION STRUCTURE Public/Granted day:2011-05-26
Information query
