Invention Grant
- Patent Title: Surface acoustic wave device including electrode fingers partially disposed in grooves in a piezoelectric substrate
- Patent Title (中): 表面声波器件包括部分地设置在压电衬底中的槽中的电极指
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Application No.: US13161029Application Date: 2011-06-15
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Publication No.: US08169121B2Publication Date: 2012-05-01
- Inventor: Tetsuya Kimura , Michio Kadota
- Applicant: Tetsuya Kimura , Michio Kadota
- Applicant Address: JP Kyoto
- Assignee: Murata Manufactoring Co., Ltd.
- Current Assignee: Murata Manufactoring Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-321198 20081217
- Main IPC: H03H9/25
- IPC: H03H9/25 ; H01L41/04

Abstract:
A surface acoustic wave device has a large electromechanical coupling coefficient, a low insertion loss, and high resistance to static electricity. In the surface acoustic wave device, a piezoelectric substance includes a plurality of grooves. Each electrode finger of an IDT electrode includes a first electrode layer disposed in the grooves and a second electrode layer disposed on the first electrode layer and located at a position higher than the upper opening of the grooves. In a surface acoustic wave device, the one-half power of the product of the cube of the average density (ρa) of the first electrode layer and the average stiffness (C44a) of the first electrode layer [(ρa3×C44a)1/2] is larger than the one-half power of the product of the cube of the average density (ρb) of the second electrode layer and the average stiffness (C44b) of the second electrode layer [(ρb3×C44b)1/2].
Public/Granted literature
- US20110241481A1 SURFACE ACOUSTIC WAVE DEVICE Public/Granted day:2011-10-06
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