Invention Grant
US08169089B2 Semiconductor device including semiconductor chip and sealing material
有权
半导体器件包括半导体芯片和密封材料
- Patent Title: Semiconductor device including semiconductor chip and sealing material
- Patent Title (中): 半导体器件包括半导体芯片和密封材料
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Application No.: US12457588Application Date: 2009-06-16
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Publication No.: US08169089B2Publication Date: 2012-05-01
- Inventor: Toshihiko Usami
- Applicant: Toshihiko Usami
- Applicant Address: JP Tokyo
- Assignee: Elpida Memory, Inc.
- Current Assignee: Elpida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2008-164207 20080624
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L23/02 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/29
Abstract:
A semiconductor device includes at least bonding wires between electrode pads on a main surface of a semiconductor chip and connection pads on a wiring board. The wires form loop shapes from the electrode pads of the semiconductor chip. The semiconductor device also includes at least forming flat parts on the loop-shaped wires, and using a sealing material to seal the semiconductor chip such as to bury the flat parts.
Public/Granted literature
- US20090315192A1 Method of manufacturing semiconductor device and semiconductor device Public/Granted day:2009-12-24
Information query
IPC分类:
