It is described a bond pad structure and a method for producing the same, the bond pad structure (1), comprising: a substrate (3) having a surface (17) to be electrically contacted; a first isolator layer (5) contacting the surface (17) of the substrate in a first region (a); a first metal layer (9) contacting the surface (17) of the substrate (3) in a second region (b) adjacent the first region (a) and partly overlapping the first isolator layer (5); a second isolator layer (11) at least partly overlapping the first isolator layer (5) and the first metal layer (9); a second metal layer (13) at least partly overlapping the second isolator layer (11) in the second region (b); wherein a maximum thickness (U) of the second metal layer (13) perpendicular to the surface (17) of the substrate (3) is smaller than a maximum thickness (t0) of the first isolator layer (5) perpendicular to the surface (17) of the substrate (3). The surface of the second isolator layer forming the highest level provides scratching protection for the bond pad structure.