Invention Grant
- Patent Title: Nested integrated circuit package on package system
- Patent Title (中): 封装系统上嵌套集成电路封装
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Application No.: US11849263Application Date: 2007-08-31
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Publication No.: US08169064B2Publication Date: 2012-05-01
- Inventor: Hyun Uk Kim
- Applicant: Hyun Uk Kim
- Applicant Address: SG Singapore US CA Fremont
- Assignee: Stats Chippac Ltd.,Stats Chippac, Inc.
- Current Assignee: Stats Chippac Ltd.,Stats Chippac, Inc.
- Current Assignee Address: SG Singapore US CA Fremont
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley Chang
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A package on package system is provided including providing a first substrate having a first integrated circuit thereon and a second substrate having a second integrated circuit thereon, the second substrate having a recess provided therein. The first and second substrates are mounted having the first integrated circuit at least partially nested in the recess.
Public/Granted literature
- US20070290319A1 NESTED INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM Public/Granted day:2007-12-20
Information query
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