Invention Grant
- Patent Title: Trench gate semiconductor device and method of manufacturing the same
- Patent Title (中): 沟槽栅极半导体器件及其制造方法
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Application No.: US12199224Application Date: 2008-08-27
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Publication No.: US08169021B2Publication Date: 2012-05-01
- Inventor: Yoshitaka Hokomoto , Takuma Hara
- Applicant: Yoshitaka Hokomoto , Takuma Hara
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-225414 20070831
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L21/336 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
A trench gate semiconductor device including: a semiconductor layer having a first conductivity type; a first diffusion region having a second conductivity type having a planar structure on the semiconductor layer; a second diffusion region having the first conductivity type positioned selectively on the first diffusion region; a gate electrode provided via a gate insulation film in each first trench facing the second diffusion region and penetrating through the first diffusion region to reach the semiconductor layer; a first semiconductor region of the second conductivity type provided at a position, in the semiconductor layer, apart in a lateral direction from the first diffusion region; a second semiconductor region of the second conductivity type provided at a position, in the first diffusion region, between the adjacent first trenches; and a main electrode in contact with the semiconductor layer and the second diffusion region.
Public/Granted literature
- US20090057757A1 TRENCH GATE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-03-05
Information query
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