Invention Grant
- Patent Title: Nonvolatile semiconductor memory device and method of manufacturing the same
- Patent Title (中): 非易失性半导体存储器件及其制造方法
-
Application No.: US12874869Application Date: 2010-09-02
-
Publication No.: US08169016B2Publication Date: 2012-05-01
- Inventor: Kazuyuki Higashi
- Applicant: Kazuyuki Higashi
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-205004 20090904
- Main IPC: H01L29/76
- IPC: H01L29/76

Abstract:
A plurality of conductive layers are stacked in a first region and a second region. A semiconductor layer is surrounded by the conductive layers in the first region, includes a columnar portion extending in a perpendicular direction with respect to a substrate. A charge storage layer is formed between the conductive layers and a side surface of the columnar portion. The conductive layers includes first trenches, second trenches, and third trenches. The first trenches are arranged in the first region so as to have a first pitch in a first direction. The second trenches are arranged in the second region so as to have a second pitch in the first direction. The third trenches are arranged in the second region so as to have a third pitch in the first direction and so as to be sandwiched by the second trenches.
Public/Granted literature
- US20110057250A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-03-10
Information query
IPC分类: