Invention Grant
- Patent Title: Compound semiconductor epitaxial substrate and process for producing the same
- Patent Title (中): 化合物半导体外延基板及其制造方法
-
Application No.: US11597613Application Date: 2005-05-26
-
Publication No.: US08169004B2Publication Date: 2012-05-01
- Inventor: Kenji Kohiro , Tomoyuki Takada , Kazumasa Ueda , Masahiko Hata
- Applicant: Kenji Kohiro , Tomoyuki Takada , Kazumasa Ueda , Masahiko Hata
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Chemical Company, Limited
- Current Assignee: Sumitomo Chemical Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2004-160847 20040531
- International Application: PCT/JP2005/010090 WO 20050526
- International Announcement: WO2005/117076 WO 20051208
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
A compound semiconductor epitaxial substrate and a process for producing the same are provided. The compound semiconductor epitaxial substrate comprises a single crystal substrate, a lattice mismatch compound semiconductor layer and a stress compensation layer, wherein the lattice mismatch compound semiconductor layer and the stress compensation layer are disposed on the identical surface side of the single crystal substrate, there is no occurrence of lattice relaxation in the lattice mismatch compound semiconductor layer, as well as the stress compensation layer, and Ls representing the lattice constant of the single crystal substrate, Lm representing the lattice constant of the lattice mismatch compound semiconductor layer, and Lc representing the lattice constant of the stress compensation layer satisfy the formula (1a) or (1b). Lm Lm>Ls>Lc (2a)
Public/Granted literature
- US20070215905A1 Compound Semiconductor Epitaxial Substrate and Process for Producing the Same Public/Granted day:2007-09-20
Information query
IPC分类: