Invention Grant
- Patent Title: Light emtting device, method for manufacturing light emitting device, and light emitting apparatus
- Patent Title (中): 发光装置，制造发光装置的方法和发光装置
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Application No.: US13097968Application Date: 2011-04-29
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Publication No.: US08168993B2Publication Date: 2012-05-01
- Inventor: Hwan Hee Jeong
- Applicant: Hwan Hee Jeong
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: KR10-2009-0020133 20090310
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L27/15
Abstract:
A light emitting device according to the embodiment includes a reflecting layer; an adhesion layer including an oxide-based material on the reflecting layer; an ohmic contact layer on the adhesion layer; and a light emitting structure layer on the ohmic contact layer.
Public/Granted literature
- US20110207252A1 LIGHT EMTTING DEVICE, METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE, AND LIGHT EMITTING APPARATUS Public/Granted day:2011-08-25
Information query
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