A thermal energy dissipating arrangement includes a semiconductor device and a thermally conductive medium. The semiconductor device includes a semiconductor circuit defining a semiconductor junction and encapsulating material in physical contact with and surrounding the semiconductor circuit. The thermally conductive medium defines an opening sized to receive the semiconductor device such that the thermally conductive medium defining the opening is in physical, thermally conductive contact with an exterior surface of the encapsulating material about the semiconductor device with the thermally conductive medium defining the opening intersecting an angle of less than or equal to a predefined angle relative to a plane defined by the semiconductor junction about a periphery of the semiconductor circuit. The thermally conductive medium absorbs thermal energy generated within the semiconductor device as a result of current flow through the semiconductor junction and rejects the absorbed thermal energy to an ambient environment surrounding the thermally conductive medium.