Invention Grant
US08168975B2 Semiconductor device and manufacturing method thereof 有权
半导体装置及其制造方法

Semiconductor device and manufacturing method thereof
Abstract:
A wiring line is electrically connected in parallel to an auxiliary wiring line via a plurality of contact holes. The contact holes are formed through an insulating film and arranged in vertical direction to the wiring line. Since the auxiliary wiring line is formed in the same layer as an electrode that constitutes a TFT, the electric resistance of the wiring line can be reduced effectively without increasing the number of manufacturing steps.
Public/Granted literature
Information query
Patent Agency Ranking
0/0