Invention Grant
- Patent Title: Thermosetting conductive paste and multilayer ceramic part having an external electrode formed using the same
- Patent Title (中): 热固性导电膏和具有使用其形成的外部电极的多层陶瓷部件
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Application No.: US12086622Application Date: 2006-12-21
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Publication No.: US08168889B2Publication Date: 2012-05-01
- Inventor: Senichi Ikarashi , Kiminori Yokoyama
- Applicant: Senichi Ikarashi , Kiminori Yokoyama
- Applicant Address: JP Niigata-shi, Niigata
- Assignee: Namics Corporation
- Current Assignee: Namics Corporation
- Current Assignee Address: JP Niigata-shi, Niigata
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2005-370460 20051222; JP2005-370965 20051222
- International Application: PCT/JP2006/325462 WO 20061221
- International Announcement: WO2007/072894 WO 20070628
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H01G4/228
Abstract:
Disclosed is a thermosetting conductive paste which is advantageous in that an external electrode for multilayer ceramic electronic part formed using the paste exhibits excellent bonding properties with an internal electrode and is suitable for mounting on a substrate or plating, achieving excellent electric properties (electrostatic capacity, tan δ. A thermosetting conductive paste comprising: (A) metal powder having a melting point of 700° C. or higher; (B) metal powder having a melting point of higher than 300 to lower than 700° C.; and (C) a thermosetting resin.
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