Invention Grant
- Patent Title: Solvent-free photocurable resin composition for protective film
- Patent Title (中): 无溶剂的光固化树脂组合物
-
Application No.: US11658642Application Date: 2005-08-01
-
Publication No.: US08168690B2Publication Date: 2012-05-01
- Inventor: Kiichiro Oguni , Kozaburo Hayashi , Satoshi Yanagida , Hidetoshi Watanabe , Naoki Okawa
- Applicant: Kiichiro Oguni , Kozaburo Hayashi , Satoshi Yanagida , Hidetoshi Watanabe , Naoki Okawa
- Applicant Address: JP Tokyo JP Tokyo JP Tokyo
- Assignee: Sony Chemical & Information Device Corp.,Sony Corp.,Sony Disc & Digital Solutions Inc.
- Current Assignee: Sony Chemical & Information Device Corp.,Sony Corp.,Sony Disc & Digital Solutions Inc.
- Current Assignee Address: JP Tokyo JP Tokyo JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2004-233605 20040810
- International Application: PCT/JP2005/014036 WO 20050801
- International Announcement: WO2006/016493 WO 20060216
- Main IPC: C03C25/28
- IPC: C03C25/28 ; C08F2/46 ; C08F220/20 ; B32B3/00 ; G03F7/028 ; G03F7/033
Abstract:
A solvent-free photocurable resin composition is provided which can be applied to the surface of optical discs or the like to form a highly transparent protective film that can stably adhere to the surface and effectively protect the surface from scratches. The solvent-free photocurable resin composition contains a urethane(meth)acrylate oligomer, a trifunctional (meth)acrylic acid ester monomer, a photopolymerization initiator, and a dilution monomer. The dilution monomer contains a fluorine-based (meth)acrylic acid ester monomer having three or more fluorine atoms and a monofunctional or difunctional (meth)acrylic acid ester monomer in amounts of from 10 to 40 wt% and from 10 to 30 wt%, respectively.
Public/Granted literature
- US20080153937A1 Solvent-Free Photocurable Resin Composition for Protective Film Public/Granted day:2008-06-26
Information query
